BROCHURE
Ephram Suhir is a Adjunct Professor,Portland State University,USA

Ephram Suhir

Adjunct Professor

Organizing Committee

USA

Portland State University

BIOGRAPHY

 Ephraim Suhir is on the faculty of Portland State University, Portland, OR, USA, Technical University, Vienna, Austria, and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA,  is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society  (IMAPS);  Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”).

 

Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. This year he received the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement award for making an exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.

 

Ephraim Suhir was a US citizen (naturalized in 1985). A goal-oriented, highly motivated and creative performer with proven leadership, administrative and coaching ability, extensive project and financial management experience, team player attitude, strong analytical and planning skills, effective communications (both written and verbal) and presentation skills, as well as excellent organizational, interpersonal, and negotiation capabilities. Possesses thorough and in-depth understanding of the state-of-the-art in materials, mechanical, electrical, optical, information, telecommunication, reliability and related areas of engineering, of new and emerging technologies, and a clear vision for the most promising directions in the development of applied science and engineering. Works exceptionally well in dynamic and rapidly changing environments, under pressure and in short time frames. Performs effectively across multiple organizations, companies and departments, with specialists from various disciplines and fields, and with people of different mentalities, origins, and cultural backgrounds. Good public speaker.

 

He communicates his ideas well to any audience. Quick learner. Exhibits strong interest in, and possesses good knowledge of, foreign cultures, values, attitudes, and customs. Always willing to learn new things and has exceptional receptiveness to, and quick grasp of, new approaches and ideas. Has a sociable disposition and gets along well with peers, supervisors, and subordinates. Bi-lingual: English and Russian. Fluent in Ukrainian (was born in Ukraine). Working knowledge of German (studied at school and when on the faculty of the Technical University in Vienna, Austria).

PUBLICATIONS

400+ publications include patents, books, book chapters, papers in archival journals and in edited conference proceedings; articles in trade magazines; numerous invited, keynote and webinar presentations to different audiences and at different conferences, symposia and technical meetings and workshops worldwide, as well as numerous short courses and tutorials.

EDUCATION

Ph.D., Dept. of Mechanics and Mathematics,  Moscow State University, Moscow, Russia

MS., Dept. of Naval Architecture, Polytechnic Institute,  Odessa, Ukraine

RESEARCH INTEREST

Applied Mathematics and Mechanics, Applied and Mathematical Physics

Materials Science and Engineering

Aerospace Electronics and Photonics

Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Assemblies, Packages and Systems

Applied Probability and Probabilistic DfR of Electronic and Photonic Devices and Systems

Analytical (Mathematical) Modeling in Applied Science and Engineering

Photonics, Fiber Optics, Mechanics of Optical Fibers 

Composite and “Smart” Materials and Systems

Thin Film Mechanics and Physics

Shock and Vibration Analyses and Testing

Dynamic Response of Materials and Structures to Shocks and Vibrations

Thermal Stress Analysis

Prediction and Prevention of Thermal Stress Failures in Electronic and Optical Engineering

Solder Materials and Solder Joint Interconnections in Electronic and Optical Engineering

Polymeric Materials in Electronics and Photonics

Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability

Nanotechnologies and Nanomaterials

Stretchable (Large Area) Electronics and Photonics: Physical Design for Reliability

Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations

Technical Diagnostics, Prognostics and Health Monitoring (PHM)

Vehicular (Aerospace, Automotive, Maritime) Electronics and Photonics: Design for Reliability

“Human-in-the-Loop”: Human-System Integration

HONORS AND AWARDS

2019 IMAPS Lifetime Achievement Award “for making an exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both”. Bestowed at the 52nd IMAPS Symp. on Microelectronics, Boston, Mass., Oct.1, 2019.

2019 IEEE EPS Electronic Packaging Field Award, “for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems.” Bestowed at the IEEE EPS conference, Las Vegas, NV, May 30, 2019

2018 IMAPS 51-st Int. Symposium on Microelectronics “best of session” Award for the presentation “Elevated stand-off heights of solder joint interconnections of surface mounted IC packages result in appreciable stress and warpage relief” (co-authored with S. Yi; J. Hwang; and R.Ghaffarian), Pasadena Convention Center, Oct. 8-11, 2018

2017 IMAPS Daniel C. Hughes, Jr. Memorial Award, the highest, most prestigious annual honor, awarded to the individual who has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS.  Recipients of this award automatically become Life Members and Fellows of the Society. Bestowed at the IMAPS  award presentation ceremony at the 50th Int. Symp. on Microelectr., Raleigh, NC, October 10, 2017

2017 IEEE EPS Exceptional Technical Achievement (ETA) Award “for the development of numerous probabilistic design concepts that enable effective and rapid assessment of the probability of failure of electronic products", bestowed at the IEEE ECTC, Lake Buena Vista, Florida (USA), June 1, 2017. 

2016 ASME Electronic and Photonic Packaging Division (EPPD) Excellence-in-Mechanics Award “to recognize outstanding contributions to the applications of applied and engineering mechanics to the field of electronic packaging and for contributions to professional activities of electronic and photonic packaging division”, bestowed at the ASME 2016 Int. Mech. Eng. Congress and Exposition (IMECE), Phoenix, AZ, Nov.16, 2016

2016 ASME Santa Clara Valley Section Technical Talk Speaker Award “in recognition of your exemplary service and dedication to the highest standards of excellence”; bestowed at the ASME Industry Honors Dinner, Santa Clara, May 05, 2016

2015 AIAA Associate Fellowship Awardfor valuable contributions to the arts, sciences, and technology of aeronautics and astronautics”

2015 ASME Santa Clara Valley Section Invited Speaker Award “for presenting ASME-SCVS Professional Development Seminars”; bestowed at the ASME Industry Honors Dinner, April 09,

2014 IEEE CPMT Society Award “for delivering the short course at the 16-th Electronic Packaging Technology Conference”, December 3-5, Singapore

2014 IEEE CPMT Society Award “in appreciation of the sustained contribution to the ECTC, 25 Years”

2014 ASME Santa Clara Valley Section Invited Speaker Award “for presenting ASME-SCVS Professional Development Seminars”; bestowed at the ASME Industry Honors Dinner, April 17

2012 SPIE Fellowship Award “for outstanding and pioneering contributions to photonics engineering”

2012 IMAPS Fellowship Award “for distinguished contributions to the packaging of microelectronic devices”

2012 ASME Santa Clara Valley Section Outstanding Achievement Award “for outstanding contribution to the engineering community”; bestowed at the ASME Industry Honors Dinner, April 19, 2012

2009 IEEE CPMT Society Award “in appreciation of the sustained contribution to the ECTC, 10 Years”

2008 Fulbright Scholarship in Information Technologies, “as pertinent to the materials and structures in; reliability, physical design, packaging, and modeling of; and risk analyses and probabilistic assessments for, the evaluation of the behavior and performance of hardware and devices in information and communication technologies and systems”

2004 ASME Worcester Reed Warner Medal for “outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems”

2004 ASME Award “for valued services in advancing engineering education as Member-at-Large of the Professional Development Board”

2002 Laser Focus World Award for the paper “Analytical Modeling Plays a Crucial Role in Photonics Engineering”, May 2002

2002 APS Fellowship Award “for distinguished contributions to the field of analytical modeling of the physical behavior and reliability of microelectronic and photonic materials and systems”.

2001 IMAPS John A. Wagnon Technical Achievement Award “for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry by advancing the art and science of predictive modeling in these areas, and laying the foundation of a discipline "Structural Analysis in Microelectronics and Photonics Systems” and for providing leadership in the application of Engineering and Applied Mechanics principles and methods to problems of physical design in microelectronics and photonics”.

2001 ASME Award for valued services in advancing the engineering profession as a keynote speaker on the topic “The Future of Microelectronics and Photonics, and the Role of Packaging”

2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award “for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society, and as a recognition of the pioneering work in Materials and Mechanical Engineering related to microelectronics and fiber-optics structures”

2000 SPE International Engineering/Technology (Fred O. Conley) Award “for outstanding pioneering and continuing contributions to plastics engineering”

1999 ASME (National) Charles Russ Richards Memorial Award “for outstanding contributions to mechanical engineering”

1998 SPE Fellowship Award “for distinguished contributions to the scientific and engineering knowledge related to plastics”

1998 IEEE CPMT Distinguished Lecturer Award “for teaching successful short courses and tutorials, and presenting invited and key-note talks in the field of Physical (Mechanical) Design and Reliability of Microelectronic and Photonic Systems”

1997 ASME INTERPack’97 General Chair Award “for organizing and conducting the  International Conference on Microelectronics and Photonics Packaging, Hawaii, June 15-19”

1996 Bell Labs Distinguished Member of Technical Staff Award “for developing engineering mechanics methods to predict the performance and reliability of structures, and in manufacturing Lucent Technologies products”, Bell Laboratories

1996 ASME Fellowship Award “for outstanding pioneering contributions to several important fields of Applied and Engineering Mechanics, and Materials Science and Engineering”,

1994 IEEE Fellowship Award “for distinguished contributions to the field of the application of Engineering Mechanics and Materials Engineering to the analysis and physical design of microelectronic and fiber optic systems”,

1994, 1995, 1996 ASME Awards “for valued services in advancing the engineering profession as Member of the Executive Committee and Chairman of the Honors and Awards Committee, ASME, Electrical and Electronic Packaging Division”.

1994 ASME  Materials Division Award “for valued services in advancing the engineering profession and for presenting the highlight topic lecture  "The Future of Microelectronics and Fiber Optics and the Role of Materials and Mechanics''”, International Mechanical Engineering Congress and Exposition

1993 AT&T Bell Laboratories Merit (Extraordinary Contribution) Award for “studies on the modeling of stresses in, and optimization of manufacturing of, plastic electronic packages and optical fibers”,

1992 ASME Clock Award “for distinguished contributions in the field of the application of Engineering Mechanics to Electronic Packaging, and for co-founding the Journal of Electronic Packaging”

1990 Outstanding Paper Award “for a paper on mechanical design and reliability of ceramic electronic packages, Institute of Electrical and Electronics Engineers”

1986 ISHM Best Paper Award “for a paper on thermal stresses in adhesively bonded and soldered assemblies, International Society for Hybrid Microelectronics”

1986 AT&T Bell Laboratories Extraordinary Contribution Award “for studies on analytical stress modeling for advanced VLSI packages”

EDITORSHIP

Advances in Materials Science and Engineering (AMSE) (2019)

Aerospace Journal (2014) 

American Research Journals, Inc. (2017)

Chinese Optical Letters (2014-2019)

Current Research in Applied Physics (2019) 

Electrical Engineering Archives (2019)

Frontiers in Engineering and Technology (2019)

Hindawi Journal of Electrical and Computer Engineering (2012) 

IEEE CPMT (currently EPS) Transactions (1994)

Int. Journal of Aeronautical Science & Aerospace Research (IJASAR) (2017) 

Int, Journal of Advanced Research in Physical Science (2019)

Int. Journal of Human Factors Modeling and Simulation (IJHFMS) (2017)

Int. Journal of Electronics and Device Physics (2019)  

Int. Journal of Innovative Research in Electronics and Communications (IJIREC) (2019)

Int. Journal of Physics Research and Applications (2019) 

Inventions and Innovations in Electrical and Electronics Engineering (IIEEE) (2018) 

Journal of Advanced Mathematics and Applications (2019)

Journal of Aerospace Engineering and Mechanics (JAEM) (2018) 

Journal of Electrical and Electronic Systems (JEES) (2019)

Journal of Experimental and Applied Mechanics (JEAM) (2019)

Journal of Materials Research: Electronic Materials (2017) 

Journal of Modern Mechanical Engineering and Technology (2019)

Journal of Physical Mathematics (2012)

Physical Science & Biophysics Journal (2019)

Scientific Journal of Research & Reviews (SJRR) (2019)

 

Upcoming Conferences